ZUDERSTORFER, Gerold, RIEDLSPERGER, Florian und SONDEREGGER, Bernhard, 2022. Cree So – software for creep simulation of complex alloys. Materials at High Temperatures. 1 November 2022. Vol. 39, no. 6, p. 596-602. DOI 10.1080/09603409.2022.2058237.
Elsevier - Harvard (with titles)Zuderstorfer, G., Riedlsperger, F., Sonderegger, B., 2022. Cree So – software for creep simulation of complex alloys. Materials at High Temperatures 39, 596-602. https://doi.org/10.1080/09603409.2022.2058237
American Psychological Association 7th editionZuderstorfer, G., Riedlsperger, F., & Sonderegger, B. (2022). Cree So – software for creep simulation of complex alloys. Materials at High Temperatures, 39(6), 596-602. https://doi.org/10.1080/09603409.2022.2058237
Springer - Basic (author-date)Zuderstorfer G, Riedlsperger F, Sonderegger B (2022) Cree So – software for creep simulation of complex alloys.. Materials at High Temperatures 39:596-602. https://doi.org/10.1080/09603409.2022.2058237
Juristische Zitierweise (Stüber) (Deutsch)Zuderstorfer, Gerold/ Riedlsperger, Florian/ Sonderegger, Bernhard, Cree So – software for creep simulation of complex alloys., Materials at High Temperatures 2022, 596-602.